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  august 2009 FCP16N60N / fcpf16n60nt n-channel mosfet ?2009 fairchild semiconductor corporation FCP16N60N / fcpf16n60nt rev. a1 www.fairchildsemi.com 1 supremos tm FCP16N60N / fcpf16n60nt n-channel mosfet 600v, 16a, 0.170 w features ? r ds(on) = 0.17 w ( typ.)@ v gs = 10v, i d = 8a ? ultra low gate charge ( typ. qg = 40.2nc) ? low effective output capacitance ? 100% avalanche tested ? rohs compliant description the supremos mosfet, fairchilds next generation of hi gh voltage super-junction mosfets, employs a deep trenc h filling process that differentiates it from preceding multi -epi based technologies. by utilizing this advanced technology and precise process control, supremos provides world class rsp, superior switching performance and ruggedness. this supremos mosfet fits the industrys ac-dc smps requirements for pfc, server/telecom power, fpd tv p ower, atx power, and industrial power applications. d g s to-220f fcpf series g s d g d s to-220 fcp series mosfet maximum ratings t c = 25 o c unless otherwise noted* thermal characteristics symbol parameter FCP16N60N fcpf16n60nt units v dss drain to source voltage 600 v v gss gate to source voltage 30 v i d drain current -continuous (t c = 25 o c) 16.0 16.0* a -continuous (t c = 100 o c) 10.1 10.1* i dm drain current - pulsed (note 1) 48.0 48.0* a e as single pulsed avalanche energy (note 2) 355 m j i ar avalanche current 5.3 a e ar repetitive avalanche energy 1.34 mj dv/dt mosfet dv/dt ruggedness 100 v/ns peak diode recovery dv/dt (not e 3) 20 v/ns p d power dissipation (t c = 25 o c) 134.4 35.7 w - derate above 25 o c 1.08 0.29 w/ o c t j , t stg operating and storage temperature range -55 to +150 o c t l maximum lead temperature for soldering purpose, 1/8 from case for 5 seconds 300 o c symbol parameter FCP16N60N fcpf16n60nt units r q jc thermal resistance, junction to case 0.93 3.5 o c/w r q cs thermal resistance, case to heat sink (typical) 0.5 0. 5 r q ja thermal resistance, junction to ambient 62.5 62.5 *drain current limited by maximum junction temperat ure
FCP16N60N / fcpf16n60nt n-channel mosfet FCP16N60N / fcpf16n60nt rev. a1 www.fairchildsemi.com 2 package marking and ordering information electrical characteristics t c = 25 o c unless otherwise noted off characteristics on characteristics dynamic characteristics switching characteristics drain-source diode characteristics device marking device package reel size tape width quanti ty FCP16N60N FCP16N60N to-220 - - 50 fcpf16n60nt fcpf16n60nt to-220f - - 50 symbol parameter test conditions min. typ. max. units bv dss drain to source breakdown voltage i d = 1ma, v gs = 0v, t c = 25 o c 600 - - v d bv dss d t j breakdown voltage temperature coefficient i d = 1ma, referenced to 25 o c - 0.73 - v/ o c i dss zero gate voltage drain current v ds = 480v, v gs = 0v - - 10 m a v ds = 480v, v gs = 0v, t c = 125 o c - - 100 i gss gate to body leakage current v gs = 30v, v ds = 0v - - 100 na v gs(th) gate threshold voltage v gs = v ds , i d = 250 m a 2.0 - 4.0 v r ds(on) static drain to source on resistance v gs = 10v, i d = 8a - 0.170 0.199 w g fs forward transconductance v ds = 40v, i d = 8a - 13 - s c iss input capacitance v ds = 100v, v gs = 0v f = 1mhz - 1630 2170 pf c oss output capacitance - 70 95 pf c rss reverse transfer capacitance - 5 10 pf c oss output capacitance v ds = 380v, v gs = 0v, f = 1mhz - 40 60 pf c oss eff. effective output capacitance v ds = 0v to 480v, v gs = 0v - 176 - pf q g(tot) total gate charge at 10v v ds = 380v, i d = 8a, v gs = 10v (note 4) - 40.2 52.3 nc q gs gate to source gate charge - 6.7 - nc q gd gate to drain miller charge - 12.9 - nc esr equivalent series resistance (g-s) drain open 2.9 w t d(on) turn-on delay time v dd = 380v, i d = 8a r g = 4.7 w (note 4) - 15.8 41.6 ns t r turn-on rise time - 15.5 41.0 ns t d(off) turn-off delay time - 60.3 130.6 ns t f turn-off fall time - 20.2 50.4 ns i s maximum continuous drain to source diode forward cu rrent - - 16 a i sm maximum pulsed drain to source diode forward curren t - - 48 a v sd drain to source diode forward voltage v gs = 0v, i sd = 8a - - 1.2 v t rr reverse recovery time v gs = 0v, i sd = 8a di f /dt = 100a/ m s - 319 - ns q rr reverse recovery charge - 4.4 - m c notes: 1. repetitive rating: pulse width limited by maximu m junction temperature 2. i as = 5.3a, r g = 25 w , starting t j = 25 c 3. i sd 16a, di/dt 200a/ m s, v dd = 380v, starting t j = 25 c 4. essentially independent of operating temperature typical characteristics
FCP16N60N / fcpf16n60nt n-channel mosfet FCP16N60N / fcpf16n60nt rev. a1 www.fairchildsemi.com 3 typical performance characteristics figure 1. on-region characteristics figure 2. transf er characteristics figure 3. on-resistance variation vs. figure 4. bod y diode forward voltage drain current and gate voltage variation vs. source current and temperature figure 5. capacitance characteristics figure 6. gate charge characteristics 0.1 1 10 20 0.1 1 10 100 *notes: 1. 250 m mm m s pulse test 2. t c = 25 o c v gs = 15.0 v 10.0 v 8.0 v 7.0 v 6.0 v 5.0 v 4.5 v 4.0 v i d , drain current[a] v ds , drain-source voltage[v] 2 4 6 8 0.1 1 10 100 -55 o c 150 o c *notes: 1. v ds = 20v 2. 250 m mm m s pulse test 25 o c i d , drain current[a] v gs , gate-source voltage[v] 0 10 20 30 40 50 0.1 0.2 0.3 0.4 0.5 0.6 *notes: t c = 25 o c v gs = 20v v gs = 10v r ds(on) [ w ww w ] , drain-source on-resistance i d , drain current [a] 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1 10 100 *notes: 1. v gs = 0v 2. 250 m mm m s pulse test 150 o c i s , reverse drain current [a] v sd , body diode forward voltage [v] 25 o c 0.1 1 10 100 600 0 2500 5000 7500 10000 c oss c iss c iss = c gs + c gd ( c ds = shorted ) c oss = c ds + c gd c rss = c gd *notes: 1. v gs = 0v 2. f = 1mhz c rss capacitances [pf] v ds , drain-source voltage [v] 0 10 20 30 40 50 0 2 4 6 8 10 *notes: i d = 8a v ds = 120v v ds = 380v v ds = 480v v gs , gate-source voltage [v] q g , total gate charge [nc]
FCP16N60N / fcpf16n60nt n-channel mosfet FCP16N60N / fcpf16n60nt rev. a1 www.fairchildsemi.com 4 typical performance characteristics (continued) figure 7. breakdown voltage variation figure 8. on-resistance variation vs. temperature vs. temperature figure 9. maximum safe operating area figure 10. maximum safe operating area _ fcpf16n60nt figure 11. maximum drain current vs. case temperature -100 -50 0 50 100 150 200 0.8 0.9 1.0 1.1 1.2 *notes: 1. v gs = 0v 2. i d = 1ma bv dss , [normalized] drain-source breakdown voltage t j , junction temperature [ o c ] -100 -50 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 *notes: 1. v gs = 10v 2. i d = 8a r ds(on) , [normalized] drain-source on-resistance t j , junction temperature [ o c ] 1 10 100 1000 0.01 0.1 1 10 100 20 m mm m s 100 m mm m s 1ms 10ms i d , drain current [a] v ds , drain-source voltage [v] operation in this area is limited by r ds(on) *notes: 1. t c = 25 o c 2. t j = 150 o c 3. single pulse dc 1 10 100 1000 0.01 0.1 1 10 100 20 m mm m s 100 m mm m s 1ms 10ms i d , drain current [a] v ds , drain-source voltage [v] operation in this area is limited by r ds(on) *notes: 1. t c = 25 o c 2. t j = 150 o c 3. single pulse dc 25 50 75 100 125 150 0 5 10 15 20 i d , drain current [a] t c , case temperature [ o c ] _ FCP16N60N
FCP16N60N / fcpf16n60nt n-channel mosfet FCP16N60N / fcpf16n60nt rev. a1 www.fairchildsemi.com 5 typical performance characteristics (continued) figure 12. transient thermal response curve _ FCP16N60N figure 13. transient thermal response curve _ fcpf16n60nt 10 -5 10 -4 10 -3 10 -2 10 -1 1 0.005 0.01 0.1 1 2 0.01 0.1 0.2 0.05 0.02 *notes: 1. z q qq q jc (t) = 0.93 o c/w max. 2. duty factor, d= t 1 /t 2 3. t jm - t c = p dm * z q qq q jc (t) 0.5 single pulse thermal response [ z q qq q jc ] rectangular pulse duration [sec] t 1 p dm t 2 10 -5 10 -4 10 -3 10 -2 10 -1 1 10 10 2 0.01 0.1 1 5 0.01 0.1 0.2 0.05 0.02 *notes: 1. z q qq q jc (t) = 3.5 o c/w max. 2. duty factor, d= t 1 /t 2 3. t jm - t c = p dm * z q qq q jc (t) 0.5 single pulse thermal response [ z q qq q jc ] rectangular pulse duration [sec] t 1 p dm t 2
FCP16N60N / fcpf16n60nt n-channel mosfet FCP16N60N / fcpf16n60nt rev. a1 www.fairchildsemi.com 6 gate charge test circuit & waveform resistive switching test circuit & waveforms unclamped inductive switching test circuit & wavef orms
FCP16N60N / fcpf16n60nt n-channel mosfet FCP16N60N / fcpf16n60nt rev. a1 www.fairchildsemi.com 7 peak diode recovery dv/dt test circuit & waveforms d u t v d s + _ d r i v e r r g s a m e t y p e a s d u t v g s ? d v / d t c o n t r o l l e d b y r g ? i s d c o n t r o l l e d b y p u l s e p e r i o d v d d l i s d 1 0 v v g s ( d r i v e r ) i s d ( d u t ) v d s ( d u t ) v d d b o d y d i o d e f o r w a r d v o l t a g e d r o p v s d i f m , b o d y d i o d e f o r w a r d c u r r e n t b o d y d i o d e r e v e r s e c u r r e n t i r m b o d y d i o d e r e c o v e r y d v / d t d i / d t d = g a t e p u l s e w i d t h g a t e p u l s e p e r i o d - - - - - - - - - - - - - - - - - - - - - - - - - - d u t v d s + _ d r i v e r r g s a m e t y p e a s d u t v g s ? d v / d t c o n t r o l l e d b y r g ? i s d c o n t r o l l e d b y p u l s e p e r i o d v d d l l i s d 1 0 v v g s ( d r i v e r ) i s d ( d u t ) v d s ( d u t ) v d d b o d y d i o d e f o r w a r d v o l t a g e d r o p v s d i f m , b o d y d i o d e f o r w a r d c u r r e n t b o d y d i o d e r e v e r s e c u r r e n t i r m b o d y d i o d e r e c o v e r y d v / d t d i / d t d = g a t e p u l s e w i d t h g a t e p u l s e p e r i o d - - - - - - - - - - - - - - - - - - - - - - - - - - d = g a t e p u l s e w i d t h g a t e p u l s e p e r i o d - - - - - - - - - - - - - - - - - - - - - - - - - -
FCP16N60N / fcpf16n60nt n-channel mosfet FCP16N60N / fcpf16n60nt rev. a1 www.fairchildsemi.com 8 dimensions in millimeters mechanical dimensions to-220
FCP16N60N / fcpf16n60nt n-channel mosfet FCP16N60N / fcpf16n60nt rev. a1 www.fairchildsemi.com 9 mechanical dimensions to-220f (7.00) (0.70) max1.47 (30 ) #1 3.30 0.10 15.80 0.20 15.87 0.20 6.68 0.20 9.75 0.30 4.70 0.20 10.16 0.20 (1.00x45 ) 2.54 0.20 0.80 0.10 9.40 0.20 2.76 0.20 0.35 0.10 ?3.18 0.10 2.54typ [2.54 0.20 ] 2.54typ [2.54 0.20 ] 0.50 +0.10 C0.05 dimensions in millimeters
? 2008 fairchild semiconductor corporation www.fairchildsemi.com trademarks the following includes registered and unregistered trademarks and se rvice marks, owned by fairchild semiconductor and/or its gl obal subsidiaries, and is not intended to be an exhaustive list of all such trademarks. accupower ? auto-spm ? build it now ? coreplus ? corepower ? crossvolt ? ctl? current transfer logic? ecospark ? efficentmax? ezswitch?* ?* ? fairchild ? fairchild semiconductor ? fact quiet series? fact ? fast ? fastvcore ? fetbench ? flashwriter ? * fps ? f-pfs ? frfet ? global power resource sm green fps ? green fps ? e-series ? g max ? gto ? intellimax ? isoplanar ? megabuck? microcoupler ? microfet ? micropak ? millerdrive? motionmax? motion-spm? optologic ? optoplanar ? ? pdp spm? power-spm ? powertrench ? powerxs? programmable active droop ? qfet ? qs ? quiet series ? rapidconfigure ? ? saving our world, 1mw/w/kw at a time? smartmax? smart start ? spm ? stealth? superfet ? supersot ? -3 supersot ? -6 supersot ? -8 supremos? syncfet? sync-lock? ? * the power franchise ? tinyboost ? tinybuck ? tinycalc ? tinylogic ? tinyopto ? tinypower ? tinypwm ? tinywire ? trifault detect ? truecurrent ? * serdes ? uhc ? ultra frfet ? unifet ? vcx ? visualmax ? xs? * trademarks of system general corporation, used under license by fairchild semiconductor. disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function, or design. fairchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. these specifications do not expand the terms of fairchild?s worldwide terms and conditions, specifically the warranty therein, which covers these products. life support policy fairchild?s products are not authorized for use as critical co mponents in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provi ded in the labeling, can be reasonably expected to result in a significant injury of the user. 2. a critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. anti-counterfeiting policy fairchild semiconductor corporation's anti-counterfeiting policy. fairchild's anti-counterfeiting policy is also stated on our external website, www.fairchildsemi.com, under sales support. counterfeiting of semiconductor parts is a growing problem in t he industry. all manufacturers of semiconductor products are exp eriencing counterfeiting of their parts. customers who inadvertently purchase counter feit parts experience many problems such as loss of brand reputation, substandard p erformance, failed applications, and increased cost of production and manufacturing delays. fairchild is taking strong measures to protect ourselves and our cus tomers from the proliferation of counterfeit parts. fairchild strongly encourages customers to purchase fairchild parts eit her directly from fairchild or from a uthorized fairchild distributors who are listed by country on our web page cited above. products customers buy either from fairchild directly or from authorized fairchi ld distributors are genuine parts, have full traceability, meet fairch ild's quality standards for handling and storage and pr ovide access to fair child's full range of up-to-date technical and product information. fairchild and our authorized distributors will stand behind all warranties and will appropr iately address any warranty issues t hat may arise. fairchild will not provide any warranty coverage or other assistance for parts bought from u nauthorized sources. fairchild is committed to combat this glo bal problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. product status definitions definition of terms datasheet identification product status definition advance information formative / in design datasheet contains the design s pecifications for product developmen t. specifications may change in any manner without notice. preliminary first production datasheet contains preliminary data; supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice to improve design. no identification needed full production datasheet contains final specific ations. fairchild semiconductor rese rves the right to make changes at any time without notice to improve the design. obsolete not in production datasheet contains specificati ons on a product that is disconti nued by fairchild semiconductor. the datasheet is for reference information only. rev. i41


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